The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs.
13,200CPH chip (laser centering/effective tact)
One multi-nozzle laser head (4 nozzles)
from 0603 0201 to 20mm square components or 26.5×11mm
0402 (01005) option factory installed.
1 Actual throughput may vary.
2 Please download brochure for details.
Main Features of SMT Pick and Place Machine
Board size M size (330×250mm)
L size (410×360mm)
L -wide (510×360mm)
E size (510×460mm)
Component size Laser recognition 0603-20mm or 26.5×11mm
(0402 (01005) optional)*2
Placement speed Chip 13,200CPH*1
Placement accuracy Laser recognition ±0.05mm
Feeder inputs Max. 80 on 8mm T/F
1 Effective tact The chip placement speed indicates an estimated value obtained when the machine places 400 1608-chips all over an M size board.
(CPH number of components placed for one hour)
2 Please ask for details on 0402(01005) placement.
