Flexible Mounters KE-2010 details:
1. SMT speed (CPH): 12500 (chip); 1850 (IC)
2. Substrate size: 330*250mm
3. Mountable component height: 6 ~ 20mm
12,500CPH: chip (laser recognition/actual production efficiency)
1,850CPH: IC (image recognition/actual production ergonomics),
3,400CPH: IC (image recognition/using MNVC)
Laser placement head x 1 (4 suction nozzles) & high-resolution visual placement head x 1 (1 suction nozzle)
0603 chip (English 0201) chip ~ 33.5mm square component,
0402 (Imperial 01005) chip is an option when leaving the factory
Image recognition (reflective/transmissive recognition, ball recognition, segmentation recognition)
4. Dimensions of components that can be attached:
Laser recognition: 0603 chip ~ 33.5mm square component
Image recognition: 1.0*0.5mm~74mm square component or 50*150mm
5. Component placement accuracy:
Laser recognition: ±0.05mm Image recognition: ±0.03mm
In addition to the machine can correspond to IC or heterosexual components with complex shapes,
It also has high-speed placement capabilities for small components.
